??Test LlV, optical spectrum, far field, polarization extinction ratio
??Automatic OCR chip/substrate lD for data binding
??Load/unload flexibly configured with waffle pack, Gel-pack and B/l fixture
??Dual test platforms for parallel test to increase UPH significantly
??Development is in progress to integrate AOl feature for defect detection
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Shenzhen Headquarters：Building 3, Yufengda Industrial Park, Guangming District, Shenzhen City, Guangdong Province, China
Reception Service Number：0755-23019639
Consultation Email：hongbin.ding@laserx.net & laserx.xs@laserx.net
About LaserxCompany ProfileDevelopment HistoryCompany CultureHonor and Qualification
ProductsBurn-in And TesterOptical AlignmentSemiconductor PackagingChip TesterHigh precision linear and goniometer slide
SolutionSmart Factory SolutionPhotonic Assembly and AlignmentIndustrial Laser Burn-in And TesterAdvanced packaging
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