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Semiconductor Packaging

Burn-in And Tester Optical Alignment Semiconductor Packaging Chip Tester High precision linear and goniometer slide

Semiconductor Packaging

Ultrasonic Wire Bonder

Product Feature

??Long gantry XY axis for large working area
??Bond quality control and assessment
??Direct drive linear motor and flying vision systems improve efficiency
??Quickly change of ultrasonic bond head supports aluminum wire, aluminum ribbon and copper wire bonding

Contact Us

Download

Product Parameter

4Ultrasonic Wire Bonder-2.jpg

Shenzhen Headquarters：Building 3, Yufengda Industrial Park, Guangming District, Shenzhen City, Guangdong Province, China

Reception Service Number：0755-23019639

Consultation Email：hongbin.ding@laserx.net & laserx.xs@laserx.net

About LaserxCompany Profile Development History Company Culture Honor and Qualification

ProductsBurn-in And Tester Optical Alignment Semiconductor Packaging Chip Tester High precision linear and goniometer slide

SolutionSmart Factory Solution Photonic Assembly and Alignment Industrial Laser Burn-in And Tester Advanced packaging

NewsCompany News Employee Care Exhibition News New Product

Copyright © 2017-2026 LASER X Technology (Shenzhen) Co., Ltd. 粵ICP備2020137519號(hào)-1

MrDing: 18923755822
hongbin.ding@laserx.net
laserx.xs@laserx.net

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