Semiconductor Packaging
Heavy Wire Bonder
Product Feature
??Dual bonding head for higher production efficiency
??Stable bonding force control improve bonding quality and reliability
??Programmable ultrasonic power at different stages
??Real-time bond line length detection
??Tension detection to ensure product quality
??Quickly change of ribbon wire, aluminum wire
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Shenzhen Headquarters:Building 3, Yufengda Industrial Park, Guangming District, Shenzhen City, Guangdong Province, China
Reception Service Number:0755-23019639
Consultation Email:hongbin.ding@laserx.net & laserx.xs@laserx.net